首页> 外国专利> COMPOSITIONS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES, METHODS FOR FABRICATING SUCH COMPOSITIONS, AND METHODS FOR FORMING DOPED REGIONS USING SUCH COMPOSITIONS

COMPOSITIONS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES, METHODS FOR FABRICATING SUCH COMPOSITIONS, AND METHODS FOR FORMING DOPED REGIONS USING SUCH COMPOSITIONS

机译:在半导体基底中形成掺杂区的组合物,制备这种组合物的方法以及使用这种组合物形成掺杂区的方法

摘要

Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions are provided. In one embodiment, a dopant-comprising composition comprises a conductivity-determining type impurity dopant, a silicate carrier, a solvent, and a moisture adsorption-minimizing component. In another embodiment, a dopant-comprising composition comprises a conductivity-determining type impurity dopant, a silicate carrier, a solvent, and a high boiling point material selected from the group consisting of glycol ethers, alcohols, and combinations thereof. The high boiling point material has a boiling point of at least about 150C.
机译:提供了用于在半导体衬底中形成掺杂区域的组合物,制造这种组合物的方法以及使用这种组合物形成掺杂区域的方法。在一个实施方案中,一种含掺杂剂的组合物包含确定电导率的杂质掺杂剂,硅酸盐载体,溶剂和最小化吸湿组分。在另一个实施方案中,包含掺杂剂的组合物包含确定电导率的类型的掺杂剂,硅酸盐载体,溶剂和选自由二醇醚,醇及其组合组成的组的高沸点材料。高沸点物质的沸点至少约为150℃。

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