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CAPACITOR CONSTRUCTIONS, RUGGED SILICON-CONTAINING SURFACES, AND METHODS OF FORMING RUGGED SILICON-CONTAINING SURFACES

机译:电容器构造,成块的含硅表面以及形成成块的含硅表面的方法

摘要

The invention encompasses a method of forming a rugged silicon-containing surface. A layer comprising amorphous silicon is provided within a reaction chamber at a first temperature. The temperature is increased to a second temperature at least 400 C higher than the first temperature while flowing at least one hydrogen isotope into the chamber. After the temperature reaches the second temperature, the layer is seeded with seed crystals. The seeded layer is then annealed to form a rugged silicon-containing surface. The rugged silicon-containing surface can be incorporated into a capacitor construction. The capacitor construction can be incorporated into a DRAM cell, and the DRAM cell can be utilized in an electronic system.
机译:本发明包括一种形成粗糙的含硅表面的方法。在第一温度下在反应室内提供包含非晶硅的层。使温度增加到比第一温度高至少400℃的第二温度,同时使至少一个氢同位素流入腔室。在温度达到第二温度之后,该层被种晶。然后将种子层退火以形成粗糙的含硅表面。崎containing的含硅表面可以并入电容器结构中。可以将电容器构造结合到DRAM单元中,并且可以在电子系统中利用DRAM单元。

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