首页> 外国专利> PROTECTIVE COATINGS FOR ORGANIC ELECTRONIC DEVICES MADE USING ATOMIC LAYER DEPOSITION AND MOLECULAR LAYER DEPOSITION TECHNIQUES

PROTECTIVE COATINGS FOR ORGANIC ELECTRONIC DEVICES MADE USING ATOMIC LAYER DEPOSITION AND MOLECULAR LAYER DEPOSITION TECHNIQUES

机译:使用原子层沉积和分子层沉积技术制造的有机电子设备的保护涂层

摘要

Coatings are applied on a flexible substrate using atomic layer deposition and molecular layer deposition methods. The coatings have thickness of up to 100 nanometers. The coatings include layers of an inorganic material such as alumina, which are separated by flexibilizing layers that are deposited with covalent chemical linkage to the inorganic material and which are one or more of silica deposited by an atomic layer deposition process; an organic polymer that is deposited by a molecular layer deposition process, or a hybrid organic-inorganic polymer that is deposited by an molecular layer deposition process.
机译:使用原子层沉积和分子层沉积方法将涂层涂覆在柔性基板上。涂层的厚度最大为100纳米。涂层包括无机材料层,例如氧化铝,其通过增韧层分开,所述增韧层通过与无机材料共价化学键沉积而沉积,并且是通过原子层沉积工艺沉积的一种或多种二氧化硅。通过分子层沉积工艺沉积的有机聚合物,或通过分子层沉积工艺沉积的杂化有机-无机聚合物。

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