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A process for making a micro-fluid ejection device having high resistance heater film

机译:具有高电阻加热膜的微流体喷射装置的制造方法

摘要

A process for making a micro-fluid ejection head comprising a semiconductor substrate. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AIN, TaN, and TaAl alloys, and has a sheet resistance from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic% tantalum, from about 10 to about 40 atomic% aluminum and from about 5 to about 30 atomic% nitrogen.
机译:制造包括半导体衬底的微流体喷射头的方法。基板包括设置在基板上的多个流体喷射致动器。每个流体喷射致动器包括薄加热器叠层,该薄加热器叠层包括薄膜加热器和与该加热器相邻的一个或多个保护层。薄膜加热器由具有基本上由AlN,TaN和TaAl合金组成的纳米晶体结构的钽铝氮化物薄膜材料制成,并且薄层电阻为每平方约30至约100欧姆。薄膜材料包含约30至约70原子%的钽,约10至约40原子%的铝和约5至约30原子%的氮。

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