首页> 外国专利> METHODS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING NON-CONTACT PRINTING PROCESSES AND DOPANT-COMPRISING INKS FOR FORMING SUCH DOPED REGIONS USING NON-CONTACT PRINTING PROCESSES

METHODS FOR FORMING DOPED REGIONS IN SEMICONDUCTOR SUBSTRATES USING NON-CONTACT PRINTING PROCESSES AND DOPANT-COMPRISING INKS FOR FORMING SUCH DOPED REGIONS USING NON-CONTACT PRINTING PROCESSES

机译:使用非接触印刷工艺在半导体基体中形成掺杂区的方法和使用非接触印刷工艺形成此类掺杂区的掺杂剂墨

摘要

Methods for forming doped regions in semiconductor substrates using non-contact printing processes and dopant-comprising inks for forming such doped regions using non-contact printing processes are provided. In an exemplary embodiment, a method for forming doped regions in a semiconductor substrate is provided. The method comprises providing an ink comprising a conductivity-determining type dopant, applying the ink to the semiconductor substrate using a non-contact printing process, and subjecting the semiconductor substrate to a thermal treatment such that the conductivity-determining type dopant diffuses into the semiconductor substrate.
机译:提供了使用非接触印刷工艺在半导体衬底中形成掺杂区的方法以及用于使用非接触印刷工艺形成此类掺杂区的含掺杂剂的墨。在示例性实施例中,提供了一种用于在半导体衬底中形成掺杂区的方法。该方法包括:提供包含导电性确定型掺杂剂的墨水;使用非接触印刷工艺将该墨施加到半导体基板;以及对半导体基板进行热处理,以使导电性确定型掺杂剂扩散到半导体中。基质。

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