Efficient integrated miniature antenna structure for multi-GHz wireless applications

摘要

The invention discloses an electronic module (100) comprising at least one substrate made of at least two layers of wiring separated by at least one layer of insulating material. The module further comprises a three-dimensional (3D) antenna structure formed on the at least one substrate out of the at least two layers of wiring and of a plurality of vas electrically connecting the at least two layers of wiring through the at least one layer of insulating material. The module also comprises at least one electronic chip assembled on the substrate to be in contact with at least one of the two layers of wiring, the electronic chip aimed at receiving and/or transmitting radio frequency signals (RF). The electrical characteristics of the 3D antenna structure are tuned to allow the antenna to be directly connected to the electronic chip on the substrate through electrically controlled wiring connections for a wavelength of the signals to be received and/or transmitted by the electronic chip.The antenna can thus be integrated in the same module as a RE transceiver chip and has performances comparable to the ones of large discrete antennas.The embodiments show an inverted antenna with folded radiating element and an optional parasitic element.