HERMETIC PACKAGE WITH LEADED FEEDTHROUGHS FOR IN-LINE FIBER OPTIC DEVICES AND METHOD OF MAKING

摘要

An inventive hermetically sealed leaded package (100) for in-line fiber optic devices, such as an optical fiber tap (106, 108, 110), is described. The package advantageously employs electrical feedthroughs that are compatible with batch processing of micromachined silicon wafers (402).