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SEMICONDUCTOR IC, CAPABLE OF REDUCING WIRING RESISTANCE BY REMARKABLY REDUCING A WIRING REGION

机译:半导体IC,可通过大幅度减少配线区域来减少配线电阻

摘要

PURPOSE: A semiconductor IC is provided to remarkably reduce wiring resistance by remarkably reducing a wiring region.;CONSTITUTION: A plurality of data transmission wires(70) transmit the output data of a data output driver. A pad outputs the output data, which is transmitted through the plurality of data transmission wires, to the outside of a semiconductor IC. An electro-static discharge circuit is arranged between the data output driver and the pad. The electro-static discharge circuit removes the static electricity which is applied to the inside of the semiconductor IC.;COPYRIGHT KIPO 2011
机译:目的:提供一种半导体IC,通过显着减小布线区域来显着降低布线电阻。;组成:多条数据传输线(70)传输数据输出驱动器的输出数据。焊盘将通过多条数据传输线传输的输出数据输出到半导体IC的外部。静电放电电路布置在数据输出驱动器和焊盘之间。静电放电电路去除了施加到半导体IC内部的静电。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20100124036A

    专利类型

  • 公开/公告日2010-11-26

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20090043071

  • 发明设计人 YOON SEOK CHEOL;

    申请日2009-05-18

  • 分类号H01L23/60;H01L27/04;

  • 国家 KR

  • 入库时间 2022-08-21 17:53:18

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