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VAPOR DEPOSITION DEVICE AND A THIN FILM MANUFACTURING METHOD, CAPABLE OF THE IMPROVEMENT OF FILM FORMATION RATE BY TRANSFERRING A DEPOSITED MATERIAL WITH CARRIER GAS
VAPOR DEPOSITION DEVICE AND A THIN FILM MANUFACTURING METHOD, CAPABLE OF THE IMPROVEMENT OF FILM FORMATION RATE BY TRANSFERRING A DEPOSITED MATERIAL WITH CARRIER GAS
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机译:气相沉积装置和薄膜制造方法,能够通过用载气转移沉积材料来改善成膜速率
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摘要
PURPOSE: A vapor deposition device and a thin film manufacturing method, capable of the improvement of film formation rate by transferring a deposited material with carrier gas, is provided to reduce deposited material loss by installing a flat ejecting part with a plurality of ejecting holes in the direction facing to a substrate.;CONSTITUTION: A vapor deposition device comprises an inlet port, a heater part, a spreader and an injection part(140). The deposited material of solid phase is guided to the inlet port. The heater part heats the deposited material flowing in and changes solid phase into gas phase. The spreader diffuses the deposited material heated with the heater part. The injection part is located to be faced with a substrate.;COPYRIGHT KIPO 2011
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