RESIN COMPOSITION FOR A PRINTED CIRCUIT BOARD IN WHICH A TRIGLYCIDYL ISOCIANURATE IS INTRODUCED AS AN EPOXY RESIN COMPOSITION AND THE PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A resin composition for a printed circuit board is provided to prevent delamination or crack in a high temperature thermal shock test due to excellent reliability.;CONSTITUTION: A resin composition for a printed circuit board comprises a composite epoxy resin, a bisphenol A type hardener, a curing accelerator and an inorganic filler. The composite epoxy resin comprises 1~8 weight% triglycidyl isocianurate resin, 1~20 weight% diglycidyl ether of bisphenol A type epoxy resin, 30~70 weight% cresol novolak epoxy resin, 20~30 weight% phosphorous-based epoxy resin and 1~20 weight% rubber-modified epoxy resin.;COPYRIGHT KIPO 2011