MULTICHIP TYPE LIGHT EMITTING DIODE PACKAGE, CAPABLE OF IMPROVING OPTICAL EFFICIENCY BY REDUCING GAPS BETWEEN LIGHT EMITTING DIODES

摘要

PURPOSE: A multichip type light emitting diode package is provided to connect a plurality of light emitting diodes and electrodes, on which the light emitting diodes are arranged, using bonding wires.;CONSTITUTION: A first light emitting diode array(241) is composed of a plurality of light emitting diodes which is arranged on either of electrodes. A second light emitting diode array(242) is composed of a plurality of light emitting diodes which is arranged on remained electrode. Bonding wires(W1, W2) connects the light emitting diodes and electrodes on which the light emitting diodes are arranged. A plurality of bonding protrusions(221, 231) is formed at the adjacent edge part of the electrodes.;COPYRIGHT KIPO 2011