SEMICONDUCTOR MANUFACTURING TAPE AND A SEMICONDUCTOR PACKAGE HAVING THE SAME, CAPABLE OF PREVENTING THE WARPAGE PHENOMENON

摘要

PURPOSE: A semiconductor manufacturing tape and a semiconductor package having the same are provided to prevent the electrical short between adjacent bonding wires by arranging the bonding wire within a semiconductor manufacturing tape.;CONSTITUTION: A tape body(110) has a first side and a second side facing the first side. A first adhesive layer(112) is formed on the first side of the tape body. A second adhesive layer(114) is formed on the second side of the tape body. A substrate comprises a plurality of bond fingers. The bonding wire interlinks the bond finger of the substrate and a bonding pad of the semiconductor chip.;COPYRIGHT KIPO 2011