首页> 外国专利> CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF MINIATURIZING WHILE IMPLEMENT LIGHTWEIGHT

CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF MINIATURIZING WHILE IMPLEMENT LIGHTWEIGHT

机译:芯片型电气双层电容器及其制造方法,可在实现轻量化的同时实现最小化

摘要

PURPOSE: A chip-type electric double layer capacitor and a method for manufacturing the same are provided to implement surface mounting without an additional structure.;CONSTITUTION: A case(110) has an accommodation space therein. The case is made of insulating resin. First and second external terminals(120a,120b) are buried in an outer case. The first and second external terminals have first side and second sides. The first side is exposed to the accommodation space. The second side is exposed to the external region of the case. An electric double layer capacitor cell is arranged in the accommodation space. The electric double layer capacitor cell is electrically connected to the first side of the external terminal.;COPYRIGHT KIPO 2011
机译:目的:提供一种芯片型双电层电容器及其制造方法,以实现表面安装而无需额外的结构。组成:壳体(110)中具有容纳空间。外壳由绝缘树脂制成。第一和第二外部端子(120a,120b)被埋在外壳中。第一和第二外部端子具有第一侧和第二侧。第一面暴露于容纳空间。第二侧面暴露于壳体的外部区域。双电层电容器单元布置在容纳空间中。双电层电容器单元电连接到外部端子的第一侧。; COPYRIGHT KIPO 2011

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