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CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF MINIATURIZING WHILE IMPLEMENT LIGHTWEIGHT
CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF MINIATURIZING WHILE IMPLEMENT LIGHTWEIGHT
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机译:芯片型电气双层电容器及其制造方法,可在实现轻量化的同时实现最小化
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摘要
PURPOSE: A chip-type electric double layer capacitor and a method for manufacturing the same are provided to implement surface mounting without an additional structure.;CONSTITUTION: A case(110) has an accommodation space therein. The case is made of insulating resin. First and second external terminals(120a,120b) are buried in an outer case. The first and second external terminals have first side and second sides. The first side is exposed to the accommodation space. The second side is exposed to the external region of the case. An electric double layer capacitor cell is arranged in the accommodation space. The electric double layer capacitor cell is electrically connected to the first side of the external terminal.;COPYRIGHT KIPO 2011
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