CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR ALCU PROCESS

摘要

PURPOSE: A CMOS image sensor big via bonding pad application for an aluminum copper process is provided to endure bonding stress by increasing the thickness of a bonding pad. CONSTITUTION: A substrate(32) has a bonding pad area and a non-bonding pad area. A first via(115) with a first dimension is formed on the bonding area of the substrate. A plurality of second vias are formed on the non-bonding area of the substrate. A plurality of second vias have a second dimension on a plane. The second dimension is smaller than the first dimension.