ACTIVE RESIN COMPOSITION IN WHICH WASHING USEFUL FOR MOUNTING FLIP-CHIPS IS UNNECESSARY AND A SURFACE MOUNTING METHOD USING THE SAME

摘要

PURPOSE: An active resin composition is provided to reduce fabrication costs by omitting a solvent cleaning step, to improve productivity and reliability of products since bubbles or gap is not present on a coated resin layer.;CONSTITUTION: An active resin composition includes, based on 100.0 parts by weight of an epoxy resin which is a solid phase at a room temperature, 1-10 parts by weight of carboxylic acid compound, 1-30 parts by weight of hardener with an initial hardening reaction temperature of 150 °C, and 10-300 parts by weight of solvent.;COPYRIGHT KIPO 2011