SUBSTRATE TRANSFER DEVICE AND SUBSTRATE PROCESSING SYSTEM CAPABLE OF RAPIDLY RETURNING A SUBSTRATE TO A SECOND SUBSTRATE ACCEPTING PART FROM A FIRST SUBSTRATE ACCEPTING PART

摘要

PURPOSE: A substrate transfer device and a substrate processing system are provided to improve the processing capability and to reduce a processing time by using the substrate transfer device.;CONSTITUTION: A substrate transfer device comprises a carrier station(10a) and a processing station(10b). The carrier station piles up semiconductor wafers(W). The process station is installed near the carrier station by performing a wafer washing process and a thermal process. A hoop(20) and a loading table(25) are arranged on the carrier station. Multiple wafers are accepted in the hoop in top and bottom direction at a regular interval. The loading table loads the hoops in a row. A transit unit(30) and a spin style process chamber(40) are arranged on the processing station. The wafer, which is transferred from the hoop, is temperately loaded on the transfer unit. The spin style process chamber transfers the wafer, which is temperately loaded on the transfer unit.;COPYRIGHT KIPO 2011