PURPOSE: A thermosetting poly-imide composition is provided to ensure high adhesive strength to a flexible substrate in a thermal annealing temperature less than 200 °C, dimensional stability, wet-proof property, and chemical resistance.;CONSTITUTION: A soluble poly-imide includes polysiloxane diamine represented by chemical formula 1 in the amount of 10~80 mol% of the whole amine and has an aryl group at the end of the poly-imide. In chemical formula 1, a is an integer of 1-10, b is an integer of 5-15, and R1 is a methyl group. The thermosetting poly-imide composition is obtained by adding 5~100 parts by mass of a compound having an aryl or acrylate group based on 100.0 parts by mass of nonvolatile components of the soluble poly-imide.;COPYRIGHT KIPO 2011
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