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SPUTTERING SYSTEM HAVING A VERTICAL TARGET AND AN OBLIQUE TARGET ON A SIDE, CAPABLE OF OFFERING CONVENIENCE OF A TARGET CHANGE BY INDEPENDENTLY DEPOSITING AND CHANGING A TARGET
SPUTTERING SYSTEM HAVING A VERTICAL TARGET AND AN OBLIQUE TARGET ON A SIDE, CAPABLE OF OFFERING CONVENIENCE OF A TARGET CHANGE BY INDEPENDENTLY DEPOSITING AND CHANGING A TARGET
PURPOSE: A sputtering system having a vertical target and an oblique target on a side is provided to enhance a sputtering yield and a sputtering rate since first and second magnets capture secondary electron around first and second deposition sources.;CONSTITUTION: A sputtering system(1) comprises a vacuum chamber(10) and first and second sputtering deposition sources(104,106). The carrier of the vacuum chamber supports workpiece. A target comprises a second flat surface and a second general surface. The second general surface is formed at a right angle to a first flat surface. The first sputtering deposition source deposits a layer on the first flat surface. A plurality of second targets of the second sputtering deposition source are assembled to form a round-corner rectangular loop surrounding the first sputtering deposition source.;COPYRIGHT KIPO 2011
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