PRINTED CIRCUIT BOARD AND A FABRICATING METHOD THE SAME, CAPABLE OF REDUCING MANUFACTURING COSTS AND TIME

摘要

PURPOSE: A printed circuit board and a fabricating method the same are provided to minimize the separation of a circuit layer by forming the outmost circuit layer through a trench method.;CONSTITUTION: A core substrate(101) has a core circuit layer(103) in both sides. A first build-up layer(105) is formed on one side of the core substrate. A second build-up layer(112) is formed on the other side of the core substrate. First and second protective layers(106, 113) respectively are formed on the first build-up layer and the second build-up layer. The first build-up layer forms a trench circuit layer through a trench method. A trench circuit layer is buried in the first protective layer.;COPYRIGHT KIPO 2011