BRACKET INTEGRATED HEAT DISSIPATION PCB FOR A BACKLIGHT UNIT, A CHASSIS STRUCTURE INCLUDING THE SAME AND MANUFACTURING METHOD THEREOF CAPABLE OF MAXIMIZING THE HEAT DISSIPATION CHARACTERISTIC

摘要

PURPOSE: A bracket integrated heat dissipation PCB for a backlight unit, a chassis structure including the same and manufacturing method thereof are provided to reduce a material cost, to simplify process/structure, and to maximize heat dissipation characteristic by unifying the heat dissipation PCB and a bracket.;CONSTITUTION: A heat dissipation PCB mounting inside the chassis structure providing light guiding path of a backlight unit includes a metal substrate(150) and a circuit layer. The metal substrate has at least one bending area and a non bending area. The circuit layer forms a circuit pattern by patterning the metal layer and laminating a metal layer on the insulating layer. The insulating layer exists only in non bending area among the metal substrate by welding the circuit layer to the non bending area.;COPYRIGHT KIPO 2011