METHOD FOR MANUFACTURING A HEAT DISSIPATION STRUCTURE INCLUDING A HEAT SINK CAPABLE OF GREATLY REDUCING THE TOTAL WEIGHT OF AN ELECTRIC COMPONENT AND THE HEAT DISSIPATION STRUCTURE

摘要

PURPOSE: A method for manufacturing a heat dissipation structure including a heat sink and the heat dissipation structure are provided to greatly improve heat absorption and heat dissipation by mutually coupling foam metal and a base plate with a thermally conductive adhesive.;CONSTITUTION: A polymer and a base plate with an open-cell structure, which can form a plating layer, are prepared(S501). The polymer and the base plate are combined by using a thermally conductive adhesive(S502). A foam metal heat sink is formed by forming a thin plating layer at the polymer and a combined portion of the base plate and the polymer(S503). The plating layer is thickened by performing electroplating after electroless plating(S504). A heat dissipation structure of integrating the foam metal heat sink and the base plate is formed(S505).;COPYRIGHT KIPO 2012