BLANKET INTEGRATED TYPE HEAT DISSIPATION CIRCUIT BOARD FORMING A HEAT DISSIPATION CIRCUIT BOARD IN AN 'L' SHAPE IN WHICH A LIGHT-EMITTING DEVICE IS ATTACHED AND A BACKLIGHT UNIT INCLUDING THE SAME

摘要

PURPOSE: A blanket integrated type heat dissipation circuit board and a backlight unit including the same are provided to engage a chassis with a heat dissipation circuit board without a blanket.;CONSTITUTION: A backlight unit includes a bottom chassis(110), a light guide plate(180) and a light-emitting module(130,170). The bottom chassis has a bottom surface and a side surface bending from the bottom surface. The light guide plate is arranged on the bottom surface of the bottom chassis. The light-emitting module is attached on the side surface or bottom surface of the bottom chassis and provides light to the side surface of the light guide plate. The light-emitting module includes a blanket integrated type heat dissipation circuit board(130) and a light-emitting device(170) inserted into the heat dissipation circuit board. The light-emitting module includes a first region attached to the side surface of the bottom chassis and a second region bent from the first region and attached to the bottom surface of the bottom chassis.;COPYRIGHT KIPO 2013