NEW GLASS FRIT, THE GLASS FRIT PASTE COMPOSITION FOR SEALING AN ELECTRIC DEVICE, AND SEALING METHOD OF AN ELECTRIC DEVICE USING THE SAME

摘要

PURPOSE: the application method of novel glass material, frit paste composition sealing device, and be provided for excellent sealing effect composition using the electronic device encapsulating method of the composition by controlling the content of frit in the composition. ;CONSTITUTION: novel glass material contain in 1 ~ 15mol% SiO2,0.ZnO in 01 ~ 5mol%, 0.01 ~ 5mol% Al2O3,45 ~ 65mol% B2O3,20 ~ 40mol% Bi2O3,0.Li2O in 01 ~ 5mol% K2O, 1 ~ 15mol%, 0.In 01 ~ 5mol% Na2O. Frit paste composition contains the frit of 40 ~ 90wt%, and 0.1 ~ 5wt% organic binders, 5 ~ 55wt% organic solvents. The step of electric device encapsulating method includes: the melt composition for positioning hermetic unit and step on frit paste composition. ;The 2011 of copyright KIPO submissions