首页> 外国专利> Lead-free low-melting glass composition, glass frit for low-temperature sealing containing the same, glass paste for low-temperature sealing, conductive material and conductive glass paste, and glass sealing parts and electric / electronic parts using the same

Lead-free low-melting glass composition, glass frit for low-temperature sealing containing the same, glass paste for low-temperature sealing, conductive material and conductive glass paste, and glass sealing parts and electric / electronic parts using the same

机译:无铅低熔点玻璃组合物,包含该组合物的用于低温密封的玻璃料,用于低温密封的玻璃糊,导电材料和导电玻璃糊以及使用该组合物的玻璃密封部件和电气/电子部件

摘要

Disclosed is an Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from Y2O3, La2O3, CeO2, Er2O3, and Yb2O3 in a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of Y2O3 and La2O3 in a total content of 0.1 to 1.0 mole percent.
机译:公开了一种Ag 2 O-V 2 O 5 -TeO 2无铅低熔点玻璃组合物,其被防止或抑制了结晶,从而在低温下更加令人满意地软化和流动。该无铅低熔点玻璃组合物包含主要成分。和一个附加组件。主要成分包括氧化钒,氧化碲和氧化银。附加成分包括选自由氧化钇和镧系元素氧化物组成的组中的至少一种。附加成分的含量以氧化物计为0.1至3.0摩尔%。附加成分优选包含选自Y 2 O 3,La 2 O 3,CeO 2,Er 2 O 3和Yb 2 O 3中的至少一种,其含量为0.1至2.0摩尔%(以氧化物计)。所述附加组分特别有效地包含Y 2 O 3和La 2 O 3中的至少一种,其总含量为0.1至1.0摩尔%。

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