RESIN COMPOSITION FOR NO-FLOW UNDERFILL AND FLIP CHIP PACKAGE ASSEMBLY USING THE SAME

摘要

PURPOSE: a kind of flip-chip package assembly that immobilising underfilling offer ensures the curing time of resin combination short improvement heat resistance and mechanical strength and high storage property are at room temperature. ;CONSTITUTION: a kind of immobilising underfilling resin combination includes epoxy resin, cationic catalyst, and thermoplastic resin is for reforming and A melting agents. The cationic catalyst is at least one salt, is selected from aromatic iodonium salts, N-benzylpyrazidium salt, aromatic series sulfonium salt, and aliphatic sulfonium salt. The structure of the compound of salt compounded of iodine is indicated by chemical formula 11. In chemical formula 1, X^- is one or more anion selected from consisting of the following group: SbF6^-, AsF6^-, PF6^- and BF4^-. ;The 2011 of copyright KIPO submissions