PHOTOCURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT OF THE PHOTOCURABLE RESIN COMPOSITION, AND PRINTED WIRING BOARD USING THE PHOTOCURABLE RESIN COMPOSITION, THE DRY FILM, AND THE CURED PRODUCT

摘要

Disclosed is a photocurable resin composition that can form a dried coating film, which is highly dry to the touch, has high sensitivity, and can form a cured film which is soft and particularly has a high insulating resistance under high temperature and humidified conditions.  Also disclosed are a dry film and a cured product of the photocurable resin composition, and a printed wiring board comprising a cured film such as a solder resist formed using the photocurable resin composition, the dry film and the cured product. The photocurable resin composition is alkaline-developable and comprises a photosensitive resin having a structure represented by general formula (I), a carboxyl group-containing resin, and a photopolymerization initiator.  Preferably, the photocurale resin composition further comprises a heat curable component and more preferably further comprises a colorant.  In general formula (I), R1s, which may be the same or different, represent a hydrogen atom and an organic group having 1 to 20 carbon atoms; R2 represents at least one functional group selected from the group consisting of alkyl groups having 1 to 10 carbon atoms, alkylene groups having 1 to 10 carbon atoms, and phenylene groups; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R5 represents a hydrogen atom or a methyl group; p is an integer of 1 to 5; q is an integer of 3 or more; m is an integer of 1 to 4; and n is an integer of 1 to 10.