NEXT GENERATION NANO DEVICE ETCHING APPARATUS FOR A LOW DAMAGE PROCESS CAPABLE OF CONTROLLING A PRECISE ETCHING PROCESS

摘要

PURPOSE: A next generation nano device etching apparatus for a low damage process is provided to supply an etching apparatus which is able to perform etching, neutral beam etching, and atomic layer etching at in-situ.;CONSTITUTION: A dip etching chamber(100) generates high density plasma. A target processing object is etched using the high density plasma. A neutral beam etching chamber(200) generates a neutral beam. The target processing object is etched using the neutral beam. Two kinds of etching chambers generate the neutral beam. The target processing object is etched using the neutral beam and the neutral beam is selected among a neutral beam atomic layer etching chamber(300). Two kinds of etching chambers are connected to a transfer chamber(400).;COPYRIGHT KIPO 2012