Method for producing electrical interlayer connection in substrate of micro-component or sensor, involves opening mask layer over substrate area provided for electrical interlayer connection, where mask layer is applied on substrate

摘要

The method involves opening a mask layer over a substrate area provided for the electrical interlayer connection. The mask layer is applied on the substrate (10). A through-hole is generated in the substrate area and an electrical interlayer connection is inserted in the through-hole. The mask layer partially remains in the area of the through-hole during opening of the mask layer, generation of the through-hole and insertion of the electrical interlayer connection. An independent claim is also included for a substrate with an opening recess.