首页> 外国专利> Method for the vacuum deposition of substrates comprises forming an active electrode surface of an electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed

Method for the vacuum deposition of substrates comprises forming an active electrode surface of an electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed

机译:用于真空沉积衬底的方法包括在处理室中形成电极布置的电极的有源电极表面,同时添加和移除电极表面。

摘要

Method for the vacuum deposition of substrates (1) comprises forming an active electrode surface (22) of at least one electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed without shifting the potential ratio in the process chamber. An independent claim is also included for a device for the vacuum deposition of substrates.
机译:用于真空沉积衬底(1)的方法包括在处理腔室中形成电极布置的至少一个电极的有源电极表面(22),同时在不移动处理腔室中电势比的情况下添加和移除电极表面。还包括用于真空沉积基板的设备的独立权利要求。

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