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Method for the vacuum deposition of substrates comprises forming an active electrode surface of an electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed
Method for the vacuum deposition of substrates comprises forming an active electrode surface of an electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed
Method for the vacuum deposition of substrates (1) comprises forming an active electrode surface (22) of at least one electrode of an electrode arrangement in the process chamber whilst the electrode surface is added and removed without shifting the potential ratio in the process chamber. An independent claim is also included for a device for the vacuum deposition of substrates.
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