首页> 外国专利> Apparatus for the production of a compound semiconductor, a method for producing a compound semiconductor and clamping device for the production of a compound semiconductor

Apparatus for the production of a compound semiconductor, a method for producing a compound semiconductor and clamping device for the production of a compound semiconductor

机译:用于制造化合物半导体的设备,用于制造化合物半导体的方法和用于制造化合物半导体的夹持装置

摘要

Compound semiconductor production and before the direction of the form of layers of a compound semiconductor, with the use of organometallic chemical vapor deposition, which comprises:a reaction vessel;a material feed opening, which a material gas of the compound semiconductor supplies from the outside into the reaction vessel;a carrier which, in the reaction vessel is arranged, wherein the support has a molded body to such, that a surface formed of the shaped body according to the top; andan opposite element, which extends over the shaped body which is supported by the support, is arranged, the opposite element with an opposite surface of the surface formed thereon, wherein the opposite surface of the formed surface is facing.
机译:使用有机金属化学气相沉积法在化合物半导体的生产之前以及在化合物半导体的层的形成方向之前,其包括:反应容器;原料进料口,化合物半导体的原料气体从外部供给在反应容器中设置有载体的载体,其中载体具有模制体,使得成型体的表面与顶部相称。布置有在由支撑件支撑的成形体上延伸的相对元件,该相对元件具有在其上形成的表面的相对表面,其中所形成的表面的相对表面面向。

著录项

  • 公开/公告号DE112009002396T5

    专利类型

  • 公开/公告日2011-07-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20091102396T

  • 发明设计人

    申请日2009-11-04

  • 分类号H01L21/205;C23C16/44;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:30

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