Method for processing semiconductor wafer during manufacturing of e.g. integrated circuit, involves arranging adhesive tape at upper end of reinforcement section of wafer, removing protective band from wafer, and removing section from tape

摘要

The method involves arranging an adhesive tape at an upper end of a circular reinforcement section of a semiconductor wafer (11), and rotating a roller at a rear side (11b) of the adhesive tape against the wafer by downward force. The reinforcement section is downwardly pressed for separating the reinforcement section from a circular recess along a circularly modified layer and attaching the adhesive tape at a lower surface of the recess and an upper end of the reinforcement section. A protective band is removed from the wafer, and the reinforcement section is removed from the adhesive tape.