Sensor i.e. gyroscope, has micromechanical structure comprising substrate, structure firmly connected with substrate, and another structure movably arranged at substrate, where latter structure is formed for enclosing former structure

摘要

The sensor (201) has a micromechanical structure (203) comprising a substrate (205) i.e. complementary metal-oxide-semiconductor wafer. A structure (211) is firmly connected with the substrate, and another structure (213) is movably arranged at the substrate. The latter structure is formed for enclosing the former structure, and comprises a frame. The latter structure is connected with the substrate by a spring, and an electrical strip guard bridge is contact less longitudinally formed for an electrical contact of the former structure over the latter structure. An independent claim is also included for a method for manufacturing a sensor.