METHOD FOR CONTROLLING THE DISTRIBUTION OF CONSTRAINTS IN A SEMICONDUCTOR TYPE STRUCTURE ON INSULATION AND CORRESPONDING STRUCTURE

摘要

characterized in that, prior to bonding, the insulating layer (4) is coated on the rear face of said support substrate with a separate material (5) which is resistant to deoxidation, a material which participates with this insulator (4) in rear face of the support substrate, to compensate at least in part the stress exerted by the buried insulator (BOX) on the support substrate (1).