WIRE ELECTRICAL DISCHARGE MACHINING DEVICE, WIRE ELECTRICAL DISCHARGE MACHINING METHOD, METHOD FOR MANUFACTURING THIN PLATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To obtain a wire electrical discharge machining device in which deterioration in machining accuracy and machining speed that are caused by shirt circuits and a decrease in the frequency of electrical discharge are improved.;SOLUTION: The wire electrical discharge machining device includes: a wire electrode 2 having a plurality of cut wires 2a each facing a workpiece 8 while being spaced apart from each other in parallel; a machining power supply 6 for generating a pulsed machining voltage; a plurality of power feed elements 7A, 7B electrically connected to the plurality of cut wires and applying the machining voltages between the plurality of cut wires and the workpiece to generate electrical discharge; a nozzle 80 which ejects treatment liquids along the plurality of cut wires toward a plurality of cut grooves formed in the workpiece by the electrical discharge, and in which ejecting holes through which the plurality of cut wires can pass are formed so as to face the workpiece; and a treatment liquid guide 100 provided on the workpiece while coming into contact with the workpiece and having a plurality of slits 101 each opened toward the workpiece and accommodating each of the plurality of cut wires one by one.;COPYRIGHT: (C)2013,JPO&INPIT