ORGANIC DEVELOPING PROCESS METHOD AND ORGANIC DEVELOPING PROCESS DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an organic developing process method and an organic developing process device capable of stabilizing a fine line width in a circuit pattern and improving throughput without using a rinsing liquid and without being influenced by a time difference in an organic developing process.SOLUTION: The developing process device carries out development by supplying a developing solution to the surface of a wafer W after a resist is applied thereon and exposed, and the device includes: a developing nozzle 30 that discharges the developing solution containing an organic solvent simultaneously to the entire surface area of the wafer W; and a gas nozzle 40 that discharges N2 gas for stopping the development and for drying to the entire surface area of the wafer W. After a liquid film of the developing solution containing the organic solvent is simultaneously formed on the entire surface area of the wafer W by discharging the developing solution to the entire surface of the wafer W from the developing nozzle 30, N2 gas is discharged to the entire surface of the wafer W from the gas nozzle 40 to stop the development as well as to remove the developing solution to dry the wafer W.