In the stamp

摘要

PROBLEM TO BE SOLVED: To fill copper well into fine recessed part of a wafer or a substrate using copper plating bath not requiring to contain additive.;SOLUTION: The copper filling method comprises: a step for applying ink comprising a copper deposition suppressing agent on a stamp of an elastomer; a step for forming a metallic seed layer on the surface of the wafer or the substrate on which the fine recessed part is formed; a step for selectively micro-contact-printing a coating film of the copper deposition suppressing agent on the surface excluding fine recessed part of the wafer or the substrate by bringing the stamp into contact with the wafer of the substrate to transfer the ink to the surface of the wafer; and a step for applying electro-copper plating on the wafer or the surface and accelerating the deposition of copper on the fine recessed part of the wafer or the substrate while suppressing the deposition of copper on the surface of the wafer or the substrate. A representative example of the copper deposition suppressing agent is polyethylene glycol-bis(1,2,3-benzotriazol ether). The copper filling utilizing the micro-contact printing uses the copper plating bath requiring no additive.;COPYRIGHT: (C)2008,JPO&INPIT