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Etching composition for copper and copper / molybdenum or copper / molybdenum alloy electrodes of the liquid crystal display device

机译:液晶显示装置的铜及铜/钼或铜/钼合金电极的蚀刻组合物

摘要

The invention relates to a copper, copper/molybdenum, or copper/molybdenum alloy electrode etching solution, comprising: based on the total weight of the etching solution, 12-35 wt% of hydrogen peroxide, 0.5-5 wt% of sulfate, 0.5-5 wt% of phosphate, 0.0001-0.5 wt% of fluorine ion, 0.1-5 wt% of first water-soluble cyclic amine, 0.1-5 wt% of chelating agent, 0.1-5 wt% of second water-soluble cyclicamine, 0.1-5 wt% of diol, and deionized water, the total weight of the etching solution being 100 wt%. The invention relates to the copper, copper/molybdenum, or copper/molybdenum alloy electrode layer etching solution for use in the process of etching gate electrode, source electrode, or collecting electrode of the thin film transistor (TFT) in the liquid crystal display device or etching metallic wire.
机译:本发明涉及一种铜,铜/钼或铜/钼合金电极蚀刻溶液,其包括:基于所述蚀刻溶液的总重量,12-35重量%的过氧化氢,0.5-5重量%的硫酸盐,0.5 -5重量%的磷酸盐,0.0001-0.5重量%的氟离子,0.1-5重量%的第一水溶性环胺,0.1-5重量%的螯合剂,0.1-5重量%的第二水溶性环胺, 0.1-5重量%的二醇和去离子水,蚀刻溶液的总重量为100重量%。本发明涉及铜,铜/钼或铜/钼合金电极层的蚀刻液,用于在液晶显示装置中对薄膜晶体管(TFT)的栅电极,源电极或集电极进行蚀刻的过程中。或蚀刻金属线。

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