The backing which keeps

摘要

PROBLEM TO BE SOLVED: To provide a device capable of picking up a chip from an adhesive film while preventing damage to the chip, and to provide a device capable of picking up a chip on an adhesive film with a high yield.;SOLUTION: The pickup device includes a frame which is fixed to a support and holds a film to which a chip is attached; a pressing instrument for pressing a surface of the film to which a chip is not attached while rotating or moving; a holding instrument which holds the chip simultaneously when or after the pressing instrument presses the film; and a moving unit for moving the holding instrument.;COPYRIGHT: (C)2007,JPO&INPIT