首页> 外国专利> FLAKE-SHAPED SILVER POWDER, METHOD FOR PRODUCING THE SAME, RESIN CURING TYPE CONDUCTIVE PASTE, AND METHOD FOR FORMING CONDUCTIVE FILM

FLAKE-SHAPED SILVER POWDER, METHOD FOR PRODUCING THE SAME, RESIN CURING TYPE CONDUCTIVE PASTE, AND METHOD FOR FORMING CONDUCTIVE FILM

机译:片状银粉,其制备方法,树脂固化型导电性糊剂和导电膜的形成方法

摘要

PROBLEM TO BE SOLVED: To provide a flake-shaped silver powder capable of attaining improvement in the conductivity of a conductive film, that is to say, reduction in the resistance of the conductive film, and to provide a method for producing the same, a resin curing type conductive paste containing the flake-shaped silver powder, and a method for forming a conductive film.;SOLUTION: The flake-shaped silver powder is obtained by coating a flake-shaped silver powder material with 0.01-0.7 mass% of a polyvalent carboxylic acid. The flake-shaped silver powder is blended in a resin curing type conductive paste. Thereby, the conductivity of a conductive film is improved, that is to say, the resistance of the conductive film is reduced.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:为了提供一种薄片状的银粉,该薄片状的银粉能够提高导电膜的导电性,即降低导电膜的电阻,并且提供一种制造该薄片状银粉的方法,包含薄片状银粉的树脂固化型导电糊剂和形成导电膜的方法。解决方案:薄片状银粉是通过在薄片状银粉材料中涂覆0.01-0.7质量%的硅酮获得的。多元羧酸。将薄片状的银粉混入树脂固化型导电膏中。从而,提高了导电膜的导电性,也就是说,减小了导电膜的电阻。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012062531A

    专利类型

  • 公开/公告日2012-03-29

    原文格式PDF

  • 申请/专利权人 DOWA ELECTRONICS MATERIALS CO LTD;

    申请/专利号JP20100207922

  • 发明设计人 EBARA ATSUSHI;NOGAMI TOKUAKI;

    申请日2010-09-16

  • 分类号B22F1/02;H01B5/00;H01B13/00;H01B1/22;B22F1/00;H01B1/00;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:25

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