首页> 外国专利> SILVER-COATED COPPER POWDER, METHOD FOR PRODUCING SILVER-COATED COPPER POWDER, AND RESIN CURING TYPE CONDUCTIVE PASTE

SILVER-COATED COPPER POWDER, METHOD FOR PRODUCING SILVER-COATED COPPER POWDER, AND RESIN CURING TYPE CONDUCTIVE PASTE

机译:银包铜粉,银包铜粉的生产方法以及树脂固化型导电胶

摘要

PROBLEM TO BE SOLVED: To provide a resin curing type conductive paste for obtaining a conductive film which is more inexpensive and has a more excellent conductivity than a conductive film formed by using a resin curing type conductive paste obtained by a conventional method, to provide a silver-coated copper powder to be blended in the resin curing type conductive paste, and to provide a method for producing the silver-coated copper powder.SOLUTION: A silver-coated copper powder is obtained by coating a material silver-coated copper powder with 0.01-0.5 mass% of a polycarboxylic acid. The silver coated copper powder is blended in a resin curing type conductive paste.
机译:解决的问题:提供一种用于获得导电膜的树脂固化型导电膏,该导电膜比通过使用通过常规方法获得的树脂固化型导电膏形成的导电膜更便宜并且具有更好的导电性,从而提供一种将银涂覆的铜粉混入树脂固化型导电浆料中,并提供一种制备该银涂覆的铜粉的方法。解决方案:通过在材料上涂覆银涂覆的铜粉,可以得到一种银涂覆的铜粉。 0.01〜0.5质量%的多元羧酸。将涂银的铜粉混入树脂固化型导电胶中。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号