FILM FOR BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, FILM FOR BACKSIDE OF DICING TAPE INTEGRATED SEMICONDUCTOR, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND FLIP-CHIP TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film for a backside of a flip-chip type semiconductor which can protect a semiconductor element, and can put various types of information, in a visible state, on the semiconductor element or a semiconductor device that is manufactured using the semiconductor element by flip-chip bonding.;SOLUTION: In a film for the backside of a flip-chip type semiconductor which is formed on a backside of a semiconductor element flip-chip bonded to a body to be bonded, light transmittance at a wavelength of 532 nm or 1064 nm is 20% or less, and contrast between a marking portion applied with a laser marking and a portion other than the marking portion is 20% or more.;COPYRIGHT: (C)2012,JPO&INPIT