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The water soluble grinding grinding processed liquid null N which contains the processed speed improver and the said processed speed

机译:包含加工速度改进剂和所述加工速度的水溶性磨粉加工液N

摘要

PROBLEM TO BE SOLVED: To provide a polishing speed improver and a water soluble polishing/grinding agent including the polishing speed improver, capable of being favorably used for polishing/grinding a silicon wafer, a ceramic, a metal, a glass and the like and attaining high polishing speed and an excellent re-dispersion effect of further deposited abrasive.;SOLUTION: This polishing speed improver consists of polyacrylamide derivative, preferably homopolymer of N, N-dimethylzinc acrylamide, or copolymer of N, N-dimethylzinc acrylamide with acrylic (acid) as active ingredient. Besides, cationic water soluble macromolecular, preferably polyethyleneimine are also included in the polishing speed improver.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供抛光速度改进剂和包括该抛光速度改进剂的水溶性抛光/研磨剂,其能够有利地用于硅晶片,陶瓷,金属,玻璃等的抛光/研磨,以及解决方案:该抛光速度改进剂由聚丙烯酰胺衍生物,优选N,N-二甲基锌丙烯酰胺的均聚物或N,N-二甲基锌丙烯酰胺与丙烯酸的共聚物组成(酸)作为有效成分。除此之外,阳离子水溶性大分子,最好是聚乙烯亚胺也包括在抛光速度改进剂中。;版权所有:(C)2008,日本特许会计师事务所

著录项

  • 公开/公告号JP4915736B2

    专利类型

  • 公开/公告日2012-04-11

    原文格式PDF

  • 申请/专利权人 株式会社興人;

    申请/专利号JP20070038162

  • 发明设计人 寺本 広司;平田 岩峰;丸山 学士;

    申请日2007-02-19

  • 分类号B24B37/00;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-21 17:38:23

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