The washing tank where the cleaning device and the processing liquid which is used for washing method,

摘要

PROBLEM TO BE SOLVED: To provide a cleaning apparatus capable of effectively removing particles at the edge of a substrate to be treated without destroying a pattern.;SOLUTION: When cleaning a wafer W inside a cleaning tub 2 wherein treating liquid to be used for cleaning the wafer W on which the pattern is formed is stored, an ultrasonic wave irradiation unit 10 for irradiating the wafer W with ultrasonic waves is used. The ultrasonic wave irradiation unit 10 is provided with a diaphragm 2b, an ultrasonic vibrator 11 mounted on the diaphragm 2b and a high frequency generation part 12 for supplying the high frequency waves of a frequency capable of outputting the ultrasonic waves of a high straight advance property to the ultrasonic vibrator 11. The ultrasonic vibrator 11 is provided only on a position corresponding to the edge part of the wafer W.;COPYRIGHT: (C)2007,JPO&INPIT