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The substrate large number separately has reached
The substrate large number separately has reached
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机译:分别达到的基板数量已达到
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摘要
In order to raise the temperature uniformity on the surface of the baseplate which we would like to heat-treat, the method of heat-treating the baseplate is offered, with this method, the baseplate large number separately is heated by control possible heat element, step and the following processing which decide new set point profile the step which detects the temperature unevenness which it occurs with respect to step and the baseplate surface where the respective set point profile is set by these heat elements, during heat treatment is located disassembles the temperature of the surface of opposite side and, to the heat element of the baseplate measures and the temperature which is detected on the basis of unevennessIt has possessed with the step which prepares the new set point profile for processing.
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