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The substrate large number separately has reached

机译:分别达到的基板数量已达到

摘要

In order to raise the temperature uniformity on the surface of the baseplate which we would like to heat-treat, the method of heat-treating the baseplate is offered, with this method, the baseplate large number separately is heated by control possible heat element, step and the following processing which decide new set point profile the step which detects the temperature unevenness which it occurs with respect to step and the baseplate surface where the respective set point profile is set by these heat elements, during heat treatment is located disassembles the temperature of the surface of opposite side and, to the heat element of the baseplate measures and the temperature which is detected on the basis of unevennessIt has possessed with the step which prepares the new set point profile for processing.
机译:为了提高我们要热处理的基板表面的温度均匀性,提供了对基板进行热处理的方法,该方法是通过控制可能的加热元件分别对大量基板进行加热,决定新的设定点轮廓的步骤和随后的处理,该步骤是检测相对于步骤和由这些加热元件设定了各个设定点轮廓的基板表面发生的温度不均匀的步骤,在进行热处理时,将温度分解相对侧的表面的相对于底板的加热元件的温度和基于不均匀性而检测到的温度具有准备用于处理的新的设定点轮廓的步骤。

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