首页> 外国专利> By using the eddy current measurement, the method of monitoring the metallization process in a real state

By using the eddy current measurement, the method of monitoring the metallization process in a real state

机译:通过使用涡流测量,在真实状态下监视金属化过程的方法

摘要

Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed. Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe.
机译:公开了一种在去除膜的过程中使用涡流探头就地获得关于样品膜的信息的方法。涡流探头具有至少一个感测线圈。将交流电压施加到涡流探头的感应线圈上。当一个或多个感测线圈靠近样品的膜放置时,在涡流探头的一个或多个感测线圈中测量一个或多个第一信号。当一个或多个感测线圈被定位成接近具有固定组成和/或距感测线圈的距离的参考材料时,在涡流探头的感测线圈中测量一个或多个第二信号。基于第二信号校准第一信号,从而校正第一信号内的不期望的增益和/或相位变化。基于校准的第一信号来确定膜的特性值。还公开了一种用于执行上述方法的设备。另外,公开了一种化学机械抛光(CMP)系统,该系统用于用抛光剂抛光样品并监测样品。该CMP系统包括抛光台,被布置为将样品保持在抛光台上的样品载体,以及涡流探针。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号