The conductive paste which the ratio of D90 for conductive paste, and prepreg, metallic foil Hari

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste which can be filled well in a through hole and can form a via which has a sufficiently low connection resistance and a sufficiently high connection reliability.;SOLUTION: The conductive paste contains conductive powder having a polyhedral shape of 1.0 to 4.0 of D90 against D10 in a particle size distribution and a hardening resin and does not contain a hardening agent, or the paste contains conductive powder, a hardening resin and a hardening agent and the conductive powder have a polyhedral shape and furthermore a ratio of D90 against D10 in a particle size distribution of the conductive powders is 1.0 to 4.0 and a hardening agent content is less than 0.3%.;COPYRIGHT: (C)2008,JPO&INPIT