Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

摘要

Purpose - The purpose of this paper is to form high density interconnection (HDI) of backboard for press-fit applications with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste should be found to obtain good electrical and physical performance of the conductive paste and avoid the simultaneous curing behavior of prepreg.