Measurement method of a semiconductor device using a semiconductor device and a measurement pattern of a measurement pattern which is to improve the reliability of the measurement

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with measurement patterns that can improve measurement reliability by improving the measurement patterns and to provide a measurement method for the semiconductor using the measurement patterns.;SOLUTION: The semiconductor device comprises: a semiconductor substrate including a chip region where a semiconductor IC is formed and a scribing region that covers the foregoing chip region; measurement patterns having a certain amount of surface cross-section space which is formed in a form of a vacant space on the surface of the semiconductor substrate within the scribing region so that a beam region on which the measurement beams of a measuring facility are projected may be included; measurement patterns inside the foregoing measurement patterns that are used for reducing a cross-section area in a vacant space of the foregoing measurement patterns, for example, the measurement patterns including dummy patterns with the ratio of the surface cross-section area of a beam region to the surface cross-section area of dummy patterns should be between 5 % and 15 %. As a result, irrespective of reduction in design rule, the generation of dishing present condition in the measurement patterns is controlled using dummy patterns, while the measurement patterns corresponding to the beam size of the measuring facility are being formed in a sufficient size in the scribing region which is distant from the chip region, and consequently the measurement reliability is raised.;COPYRIGHT: (C)2005,JPO&NCIPI