Being the micro processing treatment agent which is used for the micro processing of the lamination film which includes

摘要

PROBLEM TO BE SOLVED: To provide a fine processing treatment agent and a method for a fine processing treatment using the agent capable of effecting a fine processing treatment on a film stack of a tungsten film and a silicon oxide film through controlling an etch rate.;SOLUTION: The fine processing treatment agent of the present invention is one employed for fine processing of a film stack that includes a tungsten film and a silicon oxide film and is characterized in that it includes at least one selected from the group consisting of hydrogen fluoride, nitric acid, ammonium fluoride and ammonium chloride.;COPYRIGHT: (C)2006,JPO&NCIPI