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FAN-OUT DESIGN, METHOD OF FORMING FAN-OUT DESIGN, AND LCD ADOPTING THE FAN-OUT DESIGN

机译:扇出设计,形成扇出设计的方法以及采用LCD的扇出设计

摘要

The present invention proposes a fan-out design, a method of forming the fan-out design and a liquid crystal display adopting the fan-out design. The fan-out design has at least two metallic layers. The metallic layers, serving as conducting wires, are connected to different chip pins for transmitting signals. The two metallic layers are not overlapped near the chip pins and are overlapped away from the chip pins. The two metallic layers are separated from each other with an insulating layer. The two metallic layers are not overlapped near the chip pins, so the thickness of the chip pins is thinner. This can avoid the thickness of the fan-out design from being too thick. Besides, the two metallic layers are overlapped away from the chip pins, so the gap between every two conducting wires is greater. It makes the design and the manufacturing process easier and improves yield rate as well.
机译:本发明提出了扇出设计,形成扇出设计的方法以及采用该扇出设计的液晶显示器。扇出设计至少具有两个金属层。用作导线的金属层连接到不同的芯片引脚以传输信号。两个金属层在芯片引脚附近不重叠,并且在远离芯片引脚处重叠。两个金属层通过绝缘层彼此分离。两个金属层在芯片引脚附近不重叠,因此芯片引脚的厚度更薄。这样可以避免扇出设计的厚度过厚。此外,两个金属层远离芯片引脚重叠,因此每两根导线之间的间隙更大。它使设计和制造过程更容易,并且也提高了成品率。

著录项

  • 公开/公告号US2012257135A1

    专利类型

  • 公开/公告日2012-10-11

    原文格式PDF

  • 申请/专利权人 CHENGHUNG CHEN;ZUI WANG;

    申请/专利号US201113265140

  • 发明设计人 CHENGHUNG CHEN;ZUI WANG;

    申请日2011-04-19

  • 分类号G02F1/1333;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-21 17:35:19

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